# MCSMS 2026

## International Workshop on Mobile Cloud Computing systems, Management, and Security

## In conjunction with

## the 13 IEEE International conference on Internet of Things, Systems, Management and Security (IOTSMS 2026)

### 8-10 December 2026, Madrid, Spain

Explore Topics

## Workshop Topics

- Mobile Cloud Computing Systems
- Edge Computing Systems
- Fog Computing Systems
- Mobile Cloud Computing Security and Privacy Issues
- Mobile Cloud Computing Pricing and billing models
- Mobile Cloud Computing support for VANETS and MANETS
- Cloudlet based computing
- Lightweight authentication mechanisms in Mobile Cloud Computing architecture
- Access Control models in Mobile Cloud Computing
- Identification of incentives for FMEC service providers
- The future perspective for Mobile Cloud Computing: Challenges and Open Issues
- Mobile Cloud Computing Quality of Service (QoS) improvements techniques
- Mobile Cloud Computing architecture features and evolution
- Mobile Cloud Computing Networking and Communication considerations
- Mobile Cloud Computing Software development platform and enabled new applications

- Mobile Cloud Computing Power Efficiency for resources and networking
- Mobile Cloud Computing Availability and Quality of Service
- Security and privacy of mobile cloud computing
- Mobile Cloud Computing Resource Management, Optimization, and Migration
- Mobile Cloud Computing Support for Multimedia Communication and Game Computing
- Mobile Cloud Computing Support for Big Data Management
- Mobile Cloud Computing intrusion detection systems
- Security of pricing and billing for mobile cloud computing services
- Security of mobile, peer-to-peer and pervasive services in clouds
- Security of mobile commerce and mobile Internet of Things
- Security of mobile social networks
- Security and privacy in smartphone devices
- Security and privacy in social applications and networks
- Security of Mobile, peer-to-peer and pervasive services in clouds
- Network virtualization and cloud-based radio access networks

## Committee

### General Co-Chairs

Ouns Bouachir
Zayed University, UAE
Moayad Aloqaily
Gnowit Inc. and Carleton University, Canada

### Publicity Chair

Hideaki Nii
IIJ Innovation Institute Inc., Japan

### TPC Members

Aneta Poniszewska-Maranda, Lodz University of Technology, Poland
Andrea Omicini, Università di Bologna, Italy
George Kousiouris, National Technical University of Athens, Greece
Yang Xiang, Deakin University, Australia
Jing Selena He, Kennesaw State University, USA
Amiya Nayak, University of Ottawa, Canada
Rafal Scherer, Częstochowa University of Technology, Poland
Soumaya Cherkaoui, Université de Sherbrooke, Canada
Kaigui Bian, Virginia Tech, USA
Paolo Bellavista, DISI - University of Bologna, Italy
Ivan Demydov, Lviv Polytechnic National University, Ukraine
Milena Radenkovic, University of Nottingham, UK
Dickson K.W. Chiu, The University of Hong Kong, Hong Kong
Hamidah Ibrahim, Universiti Putra Malaysia, Malaysia
Yang Wang, La Salle University, USA
Feng Gu, City University of New York, USA
Yasir Saleem, Telecom SudParis, France
Florence Sedes, Univ. P. Sabatier, France
Ibrar Yaqoob, University of Malaya, Malaysia
Arif Ahmed, National Institute of Technology, Silchar, India
Ibrahim Abaker Targio Hashem, University of Malaya, Malaysia
Saida Maaroufi, Polytechnique Montreal, Canada
Zbigniew Leonowicz, Wroclaw University of Technology, Poland
Sebastián García, CTU University, Prague, Czech Republic
Zhiyong Zhang, Henan University of Science and Technology, China
Atsuhiro Goto, Institute of Information Security (IISEC), Japan
Chinthaka Premachandra, Tokyo University of Science, Japan
Thi Thi Zin, Miyazaki University, Japan
Suresh Veluru, United Technologies Research Centre Ireland, Ltd., Ireland
Yogachandran Rahulamathavan, City University London, UK
Neminath Hubballi, Indian Institute of Technology Indore, India
Selvakumar Manickam, National Advanced IPv6 Centre, USM, Malaysia
P. Raj, IBM Global Cloud Center of Excellence (COE), IBM, India
S. Karuppayah, Technische Universitat Darmstadt, Germany

## Important Dates

First Cycle
30 May 2026
Paper Submission
15 July 2026
Notification
30th July 2026
Camera Ready and Registration
Second Cycle
30 July 2026
Paper Submission
30 Sept 2026
Notification
15th Oct 2026
Camera Ready and Registration

## Submission Instructions and Publication

### Submission Guidelines

We invite you to submit original contributions to MCSMS 2026 via the official submission system through the Easy Chair Platform. Submissions can include technical and experimental, theoretical, conceptual, or survey papers.

### Paper Requirements

- Format: IEEE 8.5" x 11" two-column format using 10-point font
- Length: Regular papers must not exceed 6 pages (including figures, tables, and references)
- File Format: All papers must be submitted in PDF format
- Keywords: Include up to 7 keywords
- Contact Information: Complete postal and email address, phone and fax numbers of corresponding author

### Review Process

- All submissions are peer-reviewed by at least two reviewers
- Reviews based on relevance, originality, importance, and clarity
- Papers must present original unpublished research
- Must not be under review for any other conference or journal

### Publication

- Accepted papers will appear in the 13th (IEEE Technically Sponsored) IOTSMS 2026 Proceedings
- Proceedings will be submitted to IEEE Xplore for inclusion
- Indexing in EI (Compendex), Scopus, and DBLP
- Extended versions of selected papers may be invited for a Special Issues on relevant journals

Note: Authors of accepted papers are expected to present their work at the conference. High-quality papers that cannot be accepted as regular papers may be accepted as short papers.

## Submit Your Paper

Ready to submit your research? Use the official submission system below, make sure you chose the correct workshop track.

Submit Your Paper Here

## Registration and camera ready submission

for your paper to be included in the workshop and conference program, You must complete the registration and the camera ready paper submission

Follow this Link for details